According to certain regulations approved at a general meeting of shareholders on 30 May 2008 and a notice of registration acceptance from the National Association of Financial Market Institutional Investors, the company plans to issue an initial sum of up to RMB 3.5 bln worth of short-term financing bills in the national inter-bank bond market within 365 calender days at its par value and to be repaid in a lump sum.

Board of Directors
25 Sept 2008


Source: Shanghai Stock Exchange

Date: 25 Sept 2008

CN01/RL/JL/BT/KM