On 21 Aug 2008, the issuance of the company's first phase of 2008 short-term financing bonds was concluded.

A total of RMB 500 mln worth of bonds, with an interest rate of 6.1% and a one-year term to maturity, at a RMB 100 par value, have been issued.

Board of Directors
22 Aug 2008

Source: Shanghai Stock Exchange

Date: 25 Aug 2008

CN01/VL/LZ/BT/KM